SI正對Wii內部的各種零組件進行分析，
包括IBM的Broadway處理器、ATI的Hollywood影像處理器、Broadcom具備藍牙功能的BCM2042無線感測器及
其BCM4318 Wi-Fi收發器、
Qimonda的HYB18HS1232 GDDR3繪圖RAM、
三星(Samsung)的K9F4G08U0A 65奈米4G NAND快閃記憶體，
以及Elpida的S1616AGTA 16M SDRAM。
SI is currently analyzing some of the components inside the Nintendo console, including the IBM Broadway processor; ATI Hollywood graphics processor; Broadcom BCM2042 wireless sensor with Bluetooth functionality, Broadcom BCM4318 Wi-Fi transceiver; Qimonda HYB18HS1232 GDDR3 graphics RAM; Samsung K9F4G08U0A 65-nm, 4-Gbit NAND flash; and Elpida S1616AGTA 16-Mbit SDRAM.
Link from EETimes
May I know the chip inside the Wii Remote? Thanks a lot.
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